Acquired by Sheng Bang Investment Corporation

February 8

Aragio joins the Intel Foundry Services (IFS)

• Partnership with Intel IP Alliance Program
• Optimize designs with Intel technology
• Upgraded CAD tools to support Intel technology.

Completed qualification of the first GF22nm Test Chip

• GF22_FDx qualification report, Rev 1.5 on 4/16
• TSMC N7_characterization report, Rev 1.1 on 9/14
• TSMC N7_completed TSMC9000 IP registration – 3Q2021
• Expanded GF28_SLP to GF28 SLPe process – 4Q2021
• Completed all SMG28 FDSOI library designs for clients

Library offering expanded at GF, TSMC, & Samsung

• 7 complete library project developments SMG28 FDSOI
• Completed first GF22nm FDX_ULL test chip –4Q2020
• Completed first TSMCN7_FF test chip –4Q2020

Libraries increased with new technology strategy

• Initiated client library developments – SMG28 FDSOI
• Completed TSMC12nm test chip qualification – 4Q2019
• Initiated First GF22nm FDx library designs – 4Q2019

Libraries rounded out for TSMC16 / 12nm offerings

• TSMC16_FFC_1_0 characterization report – 4Q2018
• Initiated first TSMC12 FFC library designs – 4Q2018
• Final GF40_LP_4_0 test chip completed – 4Q2018

Added high performance IP and Expanded support to 7nm

• New 16nm ONFI meets 4.0 & 4.1 requirements
• Developed 12nm libraries and increased 16nm library offerings
• Added CAD tools to support 12nm and 7mn technology
• Completed 16nm test chip with all IP passing ESD and LU

Added high performance IP and Expanded Lab Capability

• Increased DDR offerings with LPDDR4 achieving 4266 MT/ sec.
• IP support for 6-Volt GPIO’s for 55nm process node
• Expanded automotive process nodes & increased 16nm Library offerings
• AC & DC -40 Deg C to +175 Deg C characterization testing for automotive

Hired new personnel and added high performance IP

• New ONFI 3_4 combo meets ONFI 3.0, ONFI 4.0, & Toggle 2.0 signaling
• IP support for 5-Volt GPIO’s for 55nm and 40nm process nodes
• Engineering staff expanded to improve customer support / characterization

Added high performance IP and Expanded Lab Capability

• Demonstrated 40nm, 1.2GHz (2.4gps) DDR4 with ODT
• Added 8 GHz Teledyne LeCroy Lab Oscilloscope for silicon characterization

Expanded Foundry Support and Client Support

• Demonstrated 28nm, 1.2GHz (2.4gps) DDR3/ DDR4 Combo with ODT
• Added over 600 sq. ft. to Local Lab Space
• All AC and DC characterization is now done “in-house”

Added Tools for FINFETS at 20nm/14nm

• Demonstrated 1GHz (2Gbps) DDR3 with ODT
• Expanded foundry support

New Increase in Support Staff

• Demonstrated 28nm libraries <20nm cell pitch
• RF ESD protect IO cap = 250fF

Increased # CAD tools

• Shrink libraries expanded to 110nm & 55nm
• CDM ESD test increased to 1KV

Doubled Number of Clients

• Began 40nm library development
• ONFI 3.0 library options provided

Doubled Size of Facilities

• Doubled # of 65nm library offerings
• +/-3KV HBM, +/-300V MM

Increased Design/layout Staff

• Common platform 65nm libraries for GF and IBM
• Custom Drivers with +/-8KV ESD

Doubled Number of IO Libaries

• Major 90nm RF libraries with +/-3KV ESD
• Chip & wire / flip-chip lib’s

Name change dba, Aragio Solutions

• Major 0.13um RF library with +/-4KV ESD

Expanded Facilities

• Major 0.18um RF library with +/-4KV ESD
• Multi-foundry support

Company Founded April 3