ESD Solutions

Memory Interfaces


Aragio Solutions offers I/O pads for a wide range of memory interfaces:

DDR – SSTL_2

DDR2 – SSTL_18

DDR3 – SSTL_15

DDR2/DDR3 combo

LPDDR2

7 way DDR combo


Memory Interfaces: DDR – SSTL_2

Summary
The SSTL_2 pad set is a full complement of I/O, power, and spacer cells (total of 14 cells) that are necessary to assemble a padring by abutment. Since the SSTL_2 normally operates with its own isolated power domain (2.5V), a “rail-splitter” support cell (SPP_RS_005_25V) is included to allow the designer to easily break the lines that should not connect to the rest of the padring, while allowing VDD and VSS to be continuous within the padring.

The cells are designed to provide the user with the option of either Class I or Class II operation that is fully compliant with the JEDEC standard JESD8-9B specification (250 MHz maximum frequency).

The reason for providing a pad set is because special control signals (POC, VREF) that are unique to the SSTL_2 I/O pads are routed through the padring. Therefore, the spacer and power supply pads must have these unique signals routed through. The VREF signal is placed to minimize any noise coupling. This enables the VREF pad (SLP_RE_000_25V) to support up to 40 SSTL_2 drivers or clock pads.

Features

  • JEDEC standard compliant
  • Supports both Class I and Class II

Diagram (driver)
figure 8

Diagram (clock driver)
figure 9

Recommended Operating Conditions

Parameter Description Min Nom Max Units
VVDD Core supply voltage 0.90 1.0 to 1.2 1.32 V
VDVDD I/O supply voltage 2.25 2.5 2.75 V
VVREF Reference voltage 1.125 1.25 1.375 V
TA Ambient operating temperature 0 25 100 °C
TJ Junction temperature -40 25 125 °C
VPAD Voltage at PAD 0   VDVDD V
VIH (dc) DC input logic high VREF+125   VDVDD+300 mV
VIL (dc) DC input logic low -300   VREF-125 mV
VIH (ac) AC input logic high VREF+250   - mV
VIL (ac) AC input logic low -   VREF-250 mV

Foundry Support

Technology Silicon proven / in production Under development Planned
28nm      
40nm TSMC    
55nm GF, UMC    
65nm GF    
90nm GF    
110nm      
130nm GF    

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Memory Interfaces: DDR2 – SSTL_18

Summary
The SSTL_18 pad set is a full complement of I/O, power, and spacer cells that are necessary to assemble a padring by abutment. Since the SSTL_18 normally operates with its own isolated power domain (1.8V), a “rail-splitter” support cell is included to allow the designer to easily break the lines that should not connect to the rest of the padring, while allowing VDD and VSS to be continuous within the padring.

The output circuitry is designed with 2.5-volt FET’s, but all parameters are guaranteed only at 1.8 volts (±10%).

The cells are designed to provide the user with the option of either 60% or full drive that is fully compliant with the JEDEC standard JESD8-15a specification up to 400 MHz (DDR800) with balanced load management.

Features

  • JEDEC standard compliant
  • SSTL_18 with selectable 60% or full drive
  • 2.5V FETs
  • Up to 400 MHz with balanced load management
  • Full complement of pads
  • 50Ω, 75Ω and 150Ω termination
  • Non-ODT reduced size driver and clock pad (30μm pitch)

Diagram (driver)
figure 10

Diagram (clock driver)
figure 11

Recommended Operating Conditions

Parameter Description Min Nom Max Units
VVDD Core supply voltage 0.90 1.0 to 1.2 1.32 V
VDVDD I/O supply voltage 1.62 1.8 1.98 V
VVREF Reference voltage 0.81 0.9 0.99 V
TA Ambient operating temperature 0 25 100 °C
TJ Junction temperature -40 25 125 °C
VPAD Voltage at PAD 0   VDVDD V
VIH (dc) DC input logic high 1 VREF+125   VDVDD+300 mV
VIL (dc) DC input logic low 1 -300   VREF-125 mV
VIH (ac) AC input logic high 1 VREF+250   - mV
VIL (ac) AC input logic low 1 -   VREF-250 mV

Foundry Support

Technology Silicon proven / in production Under development Planned
28nm      
40nm TSMC    
55nm GF    
65nm GF, TSMC    
90nm GF    
110nm      
130nm GF    

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Memory Interfaces: DDR3 – SSTL_15

Summary
The SSTL_15 pad set is a full complement of I/O, calibration, power, and spacer cells that are necessary to assemble a padring by abutment. Since the SSTL_15 normally operates with its own isolated power domain (1.5V), a “rail-splitter” support cell (SPP_RS_005_15V) is included to allow the designer to easily break the lines that should not connect to the rest of the padring, while allowing VDD and VSS to be continuous within the padring.

Features

  • Full DDR3 capability – 800MHz (1600 Mbps)
  • Low Power driving standard DDR3 memories
  • 1.8V FETs
  • Full complement of cells to build padring (20)
  • Full ODT Capability:
    • Either fixed 6-Bit programmation (program from core)
    • Or, dynamic 6-Bit PVT calibration (external reference resistor)

Diagram (driver)
figure12

Diagram (clock driver)
figure 13

Recommended Operating Conditions

Parameter Description Min Nom Max Units
VVDD Core supply voltage 0.9 1.0 to 1.1 1.115 V
VDVDD I/O supply voltage 1.425 1.5 1.575 V
VVREF Reference voltage 0.49*DVDD DVDD /2 0.51*DVDD V
TA Ambient operating temperature 0 25 100 °C
TJ Junction temperature -40 25 125 °C
VPAD Voltage at PAD 0   VDVDD V
VIH (dc) DC input logic high VREF + 0.1     V
VIL (dc) DC input logic low     VREF – 0.1 V
VIH (ac) AC input logic high VREF + 0.175   - V
VIL (ac) AC input logic low -   VREF – 0.175 V

Foundry Support

Technology Silicon proven / in production Under development Planned
28nm GF TSMC  
40nm GF, TSMC    
55nm      
65nm GF, TSMC    
90nm      
110nm      
130nm      

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Memory Interfaces: DDR2 / DDR3 Combo

Summary
The SSTL_15/18 pad set is a full complement of I/O, calibration, power, and spacer cells that are necessary to assemble a padring by abutment. Since the SSTL_15/18 normally operates with its own isolated power domain (1.5V/1.8V), a “rail-splitter” support cell (SPP_RS_005_15V) is included to allow the designer to easily break the lines that should not connect to the rest of the padring, while allowing VDD and VSS to be continuous within the padring.

Features

  • Full DDR3 capability – 800MHz (1600 Mbps)
  • Full DDR2 capability
  • Low Power driving standard DDR3 memories
  • Full complement of cells to build padring (20)
  • Full ODT Capability – dynamic 6-Bit PVT calibration (external reference resistor)

Diagram (driver)
figure 14

Diagram (clock driver)
figure 15

Recommended Operating Conditions

Parameter Description Min Nom Max Units
VVDD Core supply voltage 0.9 1.1 to 1.2 1.26 V
VDVDD (SSTL_15) I/O supply voltage 1.425 1.5 1.575 V
VDVDD (SSTL_18) I/O supply voltage 1.62 1.8 1.98 V
VVREF Reference voltage 0.81 0.9 0.99 V
TA Ambient operating temperature 0 25 100 °C
TJ Junction temperature -40 25 125 °C
VPAD Voltage at PAD 0   VDVDD V
VIH (dc) DC input logic high VREF + 0.1     V
VIL (dc) DC input logic low TBD   VREF – 0.1 V
VIH (ac) AC input logic high VREF + 0.175   - V
VIL (ac) AC input logic low -   VREF – 0.175 V

Foundry Support

Technology Silicon proven / in production Under development Planned
28nm GF, TSMC    
40nm GF, TSMC    
55nm      
65nm GF TSMC  
90nm      
110nm      
130nm      

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Memory Interfaces: LPDDR2

Summary

  • Includes a full complement of pads to assemble a LPDDR2 padring:LPDDR2 driver / receiver
  • LPDDR2 driver / receiver with CKE held low at power ramp
  • Differential clock cell
  • Power/ground pads
  • spacers

Diagram (driver)
figure 16

Diagram (clock)
figure 17

Recommended Operating Conditions

Parameter Description Min Nom Max Units
VDVDD mDDR supply voltage 1.14 1.2 1.3 V
VVDD Core supply voltage 0.8 1.0-1.2 1.32 V
TJ Junction temperature -40 25 125 °C

Foundry Support

Technology Silicon proven / in production Under development Planned
28nm   GF  
40nm      
55nm GF    
65nm GF    
90nm      
110nm      
130nm      

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Memory Interfaces: 7 way DDR combo

Summary

The LPDDR2/3_DDR3/4 libraries contain the 7-way combo driver/receiver cells with embedded power cells, the driver impedance calibration cell, and the DDR voltage reference cell providing both single-ended and differential signaling for LPDDR2, LPDDR3, LPDDR4, DDR3, DDR3L, DDR3U, and DDR4 applications. Also included is a full complement of power, corner and spacer cells to assemble a complete pad ring by abutment. An included rail splitter allows multiple power domains to be isolated in the same pad ring while maintaining continuous VDD/VSS for robust ESD protection.

Features

  • Full DDR4 capability
    • Data rates – 1600 MT/s, 1866 MT/s, 2133 MT/s, 2400 MT/s
  • Full DDR3 / DDR3L / DDR3U capability
    • Data rates – 800 MT/s, 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s, 2133 MT/s
  • Full LPDDR4 capability
    • Data rates – 1066 MT/sec, 2400 MT/sec, 3200 MT/sec, 4266 MT/sec
  • Full LPDDR3 capability
    • Data rates – 1333 MT/sec, 1600 MT/sec
  • Full LPDDR2 capability
    • Data rates – 466 MT/sec, 1066 MT/sec
  • User programmable drive strength
    • DDR3 – ZOUT = 34 / 40 Ω
    • DDR4 – ZOUT = 34 / 48 Ω
    • LPDDR2 – ZOUT = 34 / 40 / 48 / 60 / 80 Ω
    • LPDDR3 – ZOUT = 34 / 40 Ω
    • LPDDR4 – ZOUT = 40 / 48 / 60 / 80 / 120 / 240 Ω
  • User programmable on-die termination
    • DDR3 – 120 / 60 / 40 / 30 / 24 / 20 / 17 Ω
    • DDR4 – 240 / 120 / 80 / 60 / 48 / 40 / 34 Ω
    • LPDDR3 – 240 / 120 / 80 / 60 / 48 / 40 / 34 Ω
    • LPDDR4 – 240 / 120 / 80 / 60 / 48 / 40 / 34 Ω

Diagram (driver)

Diagram (clock)

Recommended operating conditions

Parameter Description   Min Nom Max Units
VVDD Core supply voltage 0.72 0.80 0.88 V
VDVDD I/O supply voltage DDR4 1.14 1.2 1.26 V
DDR3 1.425 1.5 1.575 V
DDR3L 1.283 1.35 1.45 V
DDR3U 1.19 1.25 1.31 V
LPDDR2 1.14 1.2 1.3 V
LPDDR3 1.14 1.2 1.3 V
LPDDR4 1.06 1.1 1.17 V
TJ Junction temperature -40 25 +125 °C
VPAD Voltage at PAD VDVSS

 

VDVDD V
Technology Silicon proven / in production Under development Planned
16nm   TSMC  
28nm TSMC    
40nm TSMC